products details

Home Products

SAMSUNG IC Chips

K4B4G1646E-BCNB000 Samsung IC Chips 4Gb E-die DDR3 SDRAM X16 96FBGA K4B4G1646E 1.5V

All Category

High Power LED Chip

Miss. alice

sales_deng@163.com

+86 18802688921

Contact Now

All Category

K4B4G1646E-BCNB000 Samsung IC Chips 4Gb E-die DDR3 SDRAM X16 96FBGA K4B4G1646E 1.5V

Brand Name:	Samsung
Model Number:	K4B4G1646E-BCNB000
MOQ:	100PCS
Packaging Details:	100
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

China

Document:

Product Name:

Samsung

Model:

K4B4G1646E-BCNB000

Density:

Speed:

2133 Mbps

Voltage:

1.5 V

Temperature:

0 ~ 85 °C

Supply Ability:

10000

Highlight:

K4B4G1646E-BCNB000

Samsung IC Chips 4Gb

96FBGA Samsung IC Chips

Product Description

Samsung IC chips K4B4G1646E-BCNB000 4Gb E-die DDR3 SDRAM x16 96FBGA (K4B4G1646E) 1.5V

4Gb E-die DDR3 SDRAM

x16

96FBGA with Lead-Free & Halogen-Free

(RoHS compliant)

Key Features

• JEDEC standard 1.5V(1.425V~1.575V)

• VDDQ = 1.5V(1.425V~1.575V)

• 400 MHz fCK for 800Mb/sec/pin, 533MHz fCK for 1066Mb/sec/pin,

667MHz fCK for 1333Mb/sec/pin, 800MHz fCK for 1600Mb/sec/pin,

933MHz fCK for 1866Mb/sec/pin, 1066 MHz fCK for 2133Mb/sec/pin

• 8 Banks

• Programmable CAS Latency(posted CAS): 5,6,7,8,9,10,11,13,14

• Programmable Additive Latency: 0, CL-2 or CL-1 clock

• Programmable CAS Write Latency (CWL) = 5 (DDR3-800), 6

(DDR3-1066), 7 (DDR3-1333) , 8 (DDR3-1600), 9 (DDR3-1866) and

10 (DDR3-2133)

• 8-bit pre-fetch

• Burst Length: 8 , 4 with tCCD = 4 which does not allow seamless read

or write [either On the fly using A12 or MRS]

• Bi-directional Differential Data-Strobe

• Internal(self) calibration : Internal self calibration through ZQ pin

(RZQ : 240 ohm ± 1%)

• On Die Termination using ODT pin

• Average Refresh Period 7.8us at lower than TCASE 85C, 3.9us at

85C < TCASE < 95 C

• Asynchronous Reset

• Package : 96 balls FBGA - x16

• All of Lead-Free products are compliant for RoHS

• All of products are Halogen-free

The 4Gb DDR3 SDRAM E-die is organized as a 32Mbit x 16 I/Os x 8banks,

device. This synchronous device achieves high speed double-data-rate

transfer rates of up to 2133Mb/sec/pin (DDR3-2133) for general applica

tions.

The chip is designed to comply with the following key DDR3 SDRAM fea

tures such as posted CAS, Programmable CWL, Internal (Self) Calibration,

On Die Termination using ODT pin and Asynchronous Reset .

All of the control and address inputs are synchronized with a pair of exter

nally supplied differential clocks. Inputs are latched at the crosspoint of dif

ferential clocks (CK rising and CK falling). All I/Os are synchronized with a

pair of bidirectional strobes (DQS and DQS) in a source synchronous fash

ion. The address bus is used to convey row, column and bank address

information in a RAS/CAS multiplexing style. The DDR3 device operates

with a single 1.5V(1.425V~1.575V)power supply and 1.5V(1.425V~1.575V)

VDDQ.

The 4Gb DDR3 E-die device is available in 96ball FBGAs(x16).

Tags:

samsung memory ic

samsung chips

samsung ddr4 sdram

K4A4G165WF-BCTD000 Samsung Chips 4Gb F-die DDR4 SDRAM X16 96FBGA K4A4G165WF 1.2V

Get Best Price

NT5AD512M16C4-JR Samsung IC Chips 8Gb C-Die DDR4 SDRAM 1.2V Up To 3200Mbps

Get Best Price

K4AAG085WC-BCWE000 SAMSUNG Chips 16GB DDR4 1.2V 2400Mbps 78 ball FBGA

Get Best Price

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips

TSLC Semileds LED Lamp Beads

High Power LED Chip

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips

TSLC Semileds LED Lamp Beads

High Power LED Chip

products details

K4B4G1646E-BCNB000 Samsung IC Chips 4Gb E-die DDR3 SDRAM X16 96FBGA K4B4G1646E 1.5V

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips

TSLC Semileds LED Lamp Beads

High Power LED Chip

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips