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IPB200N15N3G Infineon Chip OptiMOS3 Power Transistor N-channel normal level 175 °C operating temperature

IPB200N15N3G Infineon Chip OptiMOS3 Power Transistor N-channel normal level 175 °C operating temperature

Brand Name: Infineon Chip
Model Number: IPB200N15N3G
MOQ: 2500
Packaging Details: 2500PCS/reel
Payment Terms: T/T
Detail Information
Place of Origin:
China
Model:
IPB200N15N3G
Product Name:
Infineon Chip
Type:
SMD/SMT
Operating Temperature:
- 55 °C ~ + 175 °C
Power Dissipation:
150 W
Continuous Drain Current:
50 A
Supply Ability:
100000
Highlight:

IPB200N15N3G

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IPB200N15N3 Infineon Chip

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N-Channel OptiMOS3

Product Description

Infineon Chip IPB200N15N3G OptiMOS™3 Power-Transistor N-channel, normal level 175 °C operating temperature


OptiMOS™3 Power-Transistor N-channel, normal level 175 °C operating temperature


Features
N-channel, normal level
Excellent gate charge x R DS(on) product (FOM)
Very low on-resistance R DS(on)
175 °C operating temperature 
Pb-free lead plating; RoHS compliant 
Qualified according to JEDEC1) for target application
Ideal for high-frequency switching and synchronous rectification 
Halogen-free according to IEC61249-2-21 


Product Summary
IPB200N15N3G Infineon Chip OptiMOS3 Power Transistor N-channel normal level 175 °C operating temperature

IPB200N15N3G Infineon Chip OptiMOS3 Power Transistor N-channel normal level 175 °C operating temperature


Maximum ratings, at \(T_j\)=25 °C, unless otherwise specified: Continuous drain current \(I_D\) is 50 A at \(T_C\)=25 °C and 40 A at \(T_C\)=100 °C. Pulsed drain current \(I_{D,pulse}\) is 200 A at \(T_C\)=25 °C. Avalanche energy, single pulse \(E_{AS}\) is 170 mJ under conditions of \(I_D\)=50 A, \(R_{GS}\)=25 Ω. Reverse diode dv/dt is 6 kV/μs under conditions of \(I_D\)=50 A, \(V_{DS}\)=120 V, di/dt=100 A/μs, \(T_{j,max}\)=175 °C. Gate source voltage \(V_{GS}\) is ±20 V. Power dissipation \(P_{tot}\) is 150 W at \(T_C\)=25 °C. Operating and storage temperature \(T_j\), \(T_{stg}\) ranges from -55 °C to 175 °C. IEC climatic category; DIN IEC 68-1 is 55/175/56. Note 1: J-STD20 and JESD22. Note 2: See figure 3. Thermal characteristics: Thermal resistance, junction-case \(R_{thJC}\) has a maximum value of 1 K/W. Thermal resistance, junction-ambient \(R_{thJA}\) has a maximum value of 75 K/W with minimal footprint and a maximum value of 50 K/W with 6 cm² cooling area. Note 3: 6 cm² cooling area.

Electrical characteristics, at \(T_j\)=25 °C, unless otherwise specified. Static characteristics: Drain-source breakdown voltage \(V_{(BR)DSS}\) is 150 V under conditions of \(V_{GS}\)=0 V, \(I_D\)=1 mA. Gate threshold voltage \(V_{GS(th)}\) ranges from 2 V to 4 V with a typical value of 3 V under conditions of \(V_{DS}\)=\(V_{GS}\), \(I_D\)=90 μA. Zero gate voltage drain current \(I_{DSS}\) has a typical value of 0.1 μA and a maximum value of 1 μA at \(V_{DS}\)=120 V, \(V_{GS}\)=0 V, \(T_j\)=25 °C; at \(V_{DS}\)=120 V, \(V_{GS}\)=0 V, \(T_j\)=125 °C, its typical value is 10 μA and maximum value is 100 μA. Gate-source leakage current \(I_{GSS}\) has a typical value of 1 nA and maximum value of 100 nA under conditions of \(V_{GS}\)=20 V, \(V_{DS}\)=0 V. Drain-source on-state resistance \(R_{DS(on)}\) has a typical value of 16 mΩ and maximum value of 20 mA under both conditions of \(V_{GS}\)=10 V, \(I_D\)=50 A and \(V_{GS}\)=8 V, \(I_D\)=25 A. Gate resistance \(R_G\) has a typical value of 2.4 Ω. Transconductance \(g_{fs}\) ranges from 29 S with a typical value of 57 S under conditions of \(|V_{DS}|>2|I_D|R_{DS(on)max}\), \(I_D\)=50 A.