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IR21814STRPBF Infineon Gate Driver Using Standard Control ICs to Generate Negative Gate Bias for MOSFETs and IGBTs

IR21814STRPBF Infineon Gate Driver Using Standard Control ICs to Generate Negative Gate Bias for MOSFETs and IGBTs

Brand Name: Infineon Chip
Model Number: IR21814STRPBF
MOQ: 2500
Packaging Details: 2500PCS/reel
Payment Terms: T/T
Detail Information
Place of Origin:
China
Model:
IR21814STRPBF
Product Name:
Infineon Chip
Type:
SMD/SMT
Output Current:
1.8 A
Supply Voltage:
10 V- 20 V
Operating Temperature:
- 40 °C ~ + 125 °C
Supply Ability:
100000
Highlight:

IR21814STRPBF

,

IR21814S Infineon Gate Driver

,

Standard Control IC Gate Driver

Product Description

Infineon Chip IR21814STRPBF Using Standard Control ICs to Generate Negative Gate Bias for MOSFETs and IGBTs


Using Standard Control ICs to Generate Negative Gate Bias for MOSFETs and IGBTs


Introduction
Inherently neither the MOSFET nor the IGBT requires negative bias on the gate. Setting the gate voltage to zero
at turn-off insures proper operation and virtually provides negative bias relative to the threshold voltage of the
device. Negative gate bias does not significantly affect switching speed as opposed to the bipolar transistor.
However, there are circumstances when a negative gate drive is necessary:
• The semiconductor manufacturer specifies negative gate bias for the device
• When the gate voltage can not be held safely below the threshold voltage due to noise generated in the
circuit.
Although reference will be made to IGBTs, the information contained is equally applicable to power MOSFETs
or Silicon Carbide (SiC) MOSFETs.

DC Gate Characteristics
The minimum threshold voltage for most IGBTs is 3V at room temperature. The temperature coefficient of the
threshold voltage is always negative; increasing junction temperature results in decreasing threshold voltage. If
the junction temperature rises from 25°C to 150°C, and the temperature coefficient is -11 mV/°C, then the
threshold voltage decreases by 1.4V. Thus, a threshold voltage of 1.6V can be expected at high temperature and
worst-case conditions.

Dynamic Operation
The problem arises when the voltage increases rapidly between the collector-emitter terminals of the IGBT.
During the transient, the gate-collector (Miller) capacitance delivers charge to the gate, increasing the gate
voltage. The height and width of the voltage ‘blip’ at the gate is determined by the ratio of the gatecollector
and gate-emitter capacitances, the impedance of the drive circuit connected to the gate, and the applied dV/dt
between the collectoremitter terminals.
The internal capacitances are given on the data sheet. Notice the Miller capacitance of the IGBT is smaller than
a similarly rated MOSFET, due to the smaller die size.
The impedance to the gate can be minimized by selecting a low impedance Control IC and by minimizing the
stray inducance in the drive loop.
The dV/dt can be set to an optimum value (noise versus losses) by selecting the proper value of series gate
resistor. The series gate resistor affects only the turn-on speed of the IGBT, the turn-off speed is largely
determined by the IGBT itself. A parallel diode, with the anode towards the gate, across the gate resistor is also
recommended. The diode is reverse biased at turn-on but holds the gate down at turn-off, and during the off
state.
The Control IC has to have an electrically separated reference pin for the gate drive output. This pin should be
connected directly to the emitter terminal of the IGBT, or the Kelvin terminal of the IGBT module. The gate and
the emitter voltages are then floating on top of the noise generated by high current ground wiring, but the
difference of the two voltages (the effective drive voltage) is free from the noise.