Seoul Near UV LED-CUN0HB4A 405nmUV CU6868 series-CUN0HB4A led diodes chips
Product Brief
Description
• High power UV LED series are designed for
high current operation and ultra high power
output applications.
• It incorporates with the state of the art SMD
design and low thermal resistant material.
Features and Benefits
• Low thermal resistance
• SMT type
• Designed for high current operation
Key Applications
• UV Curing
• Printing
• Coating
• Adhesive
• Fluorescence Photography
• UV Torch
• Fluorescence Photography
• Dental Curing
• Crime Inspection
• Oil leak Detection
This high-power LED device exhibits key electro-optical performance at a forward current of 2A (under test conditions of Ts=25∘C,RH=30%): it features a peak wavelength of 405 nm, a radiant flux of 6.1 W, a forward voltage of 7.3 V, a spectral half-width of 17 nm, and a radiation angle of 70 degrees. Its absolute maximum ratings include a minimum forward current of 0.4 A (typical 2.0 A), a maximum junction temperature of 125 °C, an operating temperature range of −10 °C to 85 °C, a storage temperature range of −40 °C to 100 °C, and a thermal resistance (junction to solder point) of 1.8 °C/W.
At a forward current of 2A, this LED follows a structured binning system defined by three key parameters: peak wavelength (Wp), radiant flux, and forward voltage (Vf). For peak wavelength, there are two bins: P1 (400–405 nm) and P2 (405–410 nm). For radiant flux, two bins are available: T55 (5.56–6.12 W) and T61 (6.12–6.73 W). For forward voltage, three bins are defined: Z70 (7.0–7.2 V), Z72 (7.2–7.4 V), and Z74 (7.4–7.6 V). The binning code is structured such that segments Z₁Z₂ denote peak wavelength (nm), Z₃Z₄Z₅ represent radiant flux (W), and Z₆Z₇Z₈ indicate forward voltage (V), enabling precise component selection for specific application requirements.