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ISO1640BDR TI Chips ISO164x Hot Swappable Bidirectional I2C Isolators with Enhanced EMC and GPIOs

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ISO1640BDR TI Chips ISO164x Hot Swappable Bidirectional I2C Isolators with Enhanced EMC and GPIOs

Brand Name:	TI chips
Model Number:	ISO1640BDR
MOQ:	3000
Packaging Details:	3000PCS/reel
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

China

Document:

Model:

ISO1640BDR

Type:

SMD/SMT

Product Name:

TI Chips

Operating Temperature:

- 40 °C~+ 125 °C

Power Dissipation:

96 MW

Encapsulation:

Supply Ability:

1000000

Highlight:

ISO1640BDR

ISO1640 TI Chips

Hot Swappable Isolators

Product Description

TI chips ISO1640BDR ISO164x Hot-Swappable Bidirectional I2C Isolators with Enhanced EMC and GPIOs

Features

• Robust Isolated Bidirectional, I2C Compatible,

Communication

– ISO1640: Bidirectional SDA and SCL

communication

– ISO1641: Bidirectional SDA and unidirectional

SCL communication

– ISO1642/3/4: Bidirectional SDA and SCL

communication with either 2 or 3 unidirectional

GPIO channels

– Hot-Swappable SDA and SCL

• Bidirectional data transfer up to 1.7 MHz Operation

• Up to 3 additional unidirectional isolated GPIO

channels supporting 50 Mbps speed

• Robust isolation barrier with enhanced EMC:

– >100-year projected lifetime at 450 VRMS

working voltage (D-8) and 1500 VRMS working

voltage (DW-16)

– Up to 5000 VRMS isolation rating per UL1577

– Up to 10 kV reinforced surge capability

– ±100 kV/μs typical CMTI

– ±8 kV IEC-ESD 61000-4-2 contact discharge

protection across isolation barrier

– Same side ±8 kV IEC-ESD unpowered contact

discharge on SCL2 and SDA2 (Side 2)

• Supply range: 3 V to 5.5 V (Side 1) and 2.25 V to

5.5 V (Side 2)

• Open-drain outputs with 3.5-mA (Side 1) and 50-

mA (Side 2) current-sink capability

• Max capacitive load: 80 pF (Side 1) and 400 pF

(Side 2)

• 16-SOIC (DW-16) and 8-SOIC (D-8) Package

Options

• –40°C to +125°C Operating Temperature

• Safety-Related Certifications (planned):

– UL 1577 Component Recognition Program

– DIN VDE V 0884-11

– IEC 62368-1, IEC 61010-1, IEC 60601-1 and

GB4943.1-2011 certifications

Applications

• Isolated I2C Buses

• Isolated I2C and SPI Buses

• SMBus and PMBus Interfaces

• Power Over Ethernet (PoE)

• Motor Control Systems

• Battery Management

Description

The ISO1640, ISO1641, ISO1642, ISO1643 and

ISO1644 (ISO164x) devices are hot swappable, low-

power, bidirectional isolators that are compatible

with I2C interfaces. The ISO164x supports UL 1577

isolation ratings of 5000 VRMS in the 16-DW package,

and 3000 VRMS in the 8-D package. Each I2C

isolation channel in this low emissions device has

a logic input and open drain output separated by

a double capacitive silicon dioxide (SiO2) insulation

barrier. The ISO1642 and ISO1643 intregrates 2

unidirectional CMOS isolation channels, while the

ISO1644 intregrates 3 unidirectional CMOS isolation

channels which can be used for static GPIO isolation

or to isolate a Serial Peripheral Interface (SPI) bus.

This family includes basic and reinforced insulation

devices certified by VDE, UL, CSA, TUV and CQC.

The ISO1640/2/3/4 have two isolated bidirectional

channels for clock and data lines and the ISO1641

has a bidirectional data and a unidirectional clock

channel. The ISO164x family integrates logic required

to support bidirectional channels, providing a much

simpler design and smaller footprint when compared

to optocoupler-based solutions.

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products details

ISO1640BDR TI Chips ISO164x Hot Swappable Bidirectional I2C Isolators with Enhanced EMC and GPIOs

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