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News Details
Created with Pixso. Home Created with Pixso. News Created with Pixso.

Ams‑Osram launches MicroLED optical transmission simulation platform to accelerate high‑speed interconnect design for AI

Ams‑Osram launches MicroLED optical transmission simulation platform to accelerate high‑speed interconnect design for AI

2026-08-19

Ams‑Osram launches MicroLED optical transmission simulation platform to accelerate high‑speed interconnect design for AI Data Centers


latest company news about Ams‑Osram launches MicroLED optical transmission simulation platform to accelerate high‑speed interconnect design for AI 0

Fueled by explosive growth in AI demands, massive capital investment is pouring into data‑center infrastructure. Both training state‑of‑the‑art large models and running inference workloads for AI agents such as ChatGPT and Claude require massive computing power.

An AI data center consists of networks built by interconnecting processors and storage devices. Currently, copper‑based backplanes and cables dominate the links connecting these computing systems. Nevertheless, data centers worldwide are confronted with a severe shared challenge: network bandwidth, whether within or across servers, needs substantial improvement.

From a technical perspective, the conventional approach is to keep boosting signal transmission frequencies over copper‑wire networks. This method, however, is approaching physical limits. As transmission frequency rises, per‑bit energy consumption, heat generation and system complexity surge simultaneously. Hence, the industry is actively pursuing alternative solutions.

Against this backdrop, AMS‑OSRAM is developing an optical‑transmission solution based on microLED for high‑bandwidth data transfer within AI data centers. Traditional high‑bandwidth optical networks adopt a “fast‑but‑narrow” paradigm: data is transmitted over a single optical fiber at extremely high frequencies. By contrast, AMS‑OSRAM leverages a “slow‑but‑wide” architecture, employing hundreds to thousands of parallel‑operating microLED transmitters to replace single high‑speed, high‑power laser transmitters.

The microLED array alongside its drive‑and‑control technology has already achieved commercial deployment on AMS‑OSRAM’s EVIYOS™ platform for automotive lighting. This solidly demonstrates that the company has overcome manufacturing and co‑packaging challenges for high‑density microLED transmitters and digital control circuits.

Nevertheless, the microLED devices for data communication differ from those used in automotive lighting in both performance specifications and implementation approaches. At present, network‑equipment manufacturers aiming to drive innovation with microLED are still awaiting definitive verification results to validate the performance of such systems under real‑world operating conditions in data centers.

01
Simulation Model: Replicate Link‑Level Performance under Real‑World Operating Conditions

To this end, AMS‑OSRAM has developed a methodology for precise validation against industry‑specification requirements. The company has built a high‑fidelity system‑level simulation model capable of comprehensively evaluating the performance of microLED‑based communication links driven by real‑world AI data streams.

The AMS‑OSRAM system‑level model integrates time‑domain, frequency‑domain and bit‑error‑rate (BER) simulation capabilities. It can simulate the transmission characteristics of microLEDs, photodiodes, lenses and various types of optical fibers, as well as transmit equalizers, drivers, receive equalizers and amplifiers. In other words, this model fully covers all core building blocks of the electro‑optical front‑end for optical data links in AI servers.
latest company news about Ams‑Osram launches MicroLED optical transmission simulation platform to accelerate high‑speed interconnect design for AI 1
These device‑level models combine empirically‑measured microLED characteristic parameters with physical‑behavior models of other components. They enable comprehensive analysis of the impacts exerted by key electrical and optical parameters, including microLED radiation distribution, photodiode responsivity, as well as chromatic dispersion and modal dispersion of optical fibers. On this basis, the simulation model can accurately output key performance indicators (KPIs) such as bit‑error rate, energy‑per‑bit and signal‑to‑noise ratio.

Users can flexibly calculate various KPIs for designated operating conditions and component combinations. For instance, the model can intuitively demonstrate dynamic KPI variations triggered by changes in fiber length or fiber type. When optimizing toward a targeted bit‑error rate, users may also leverage the model to evaluate and trade‑off performance versus energy consumption.

Reverse derivation is also supported. Based on given system‑optimization requirements, the model can back‑calculate the specific specification requirements for each component within the link.

02
Ongoing Expansion: High‑Reliability Simulation Enables Accurate Solution Validation and Optimization

Currently, functionalities of this model are under continuous expansion. Future plans include incorporating simulation items for electrical and optical crosstalk between densely‑packed microLEDs and photodiodes, as well as thermal characteristics of packaged devices.
latest company news about Ams‑Osram launches MicroLED optical transmission simulation platform to accelerate high‑speed interconnect design for AI 2
For potential partners and customers including network‑equipment manufacturers, this means that before investing in the design and manufacturing of their first microLED‑based data interconnect hardware, they can conduct accurate solution validation and optimization through reliable system‑level link modeling.

With this simulation model, partners can precisely define the technical requirements for each individual component in the data link, evaluate the supply availability of required components, and fully verify the feasibility of the overall system design.
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News Details
Created with Pixso. Home Created with Pixso. News Created with Pixso.

Ams‑Osram launches MicroLED optical transmission simulation platform to accelerate high‑speed interconnect design for AI

Ams‑Osram launches MicroLED optical transmission simulation platform to accelerate high‑speed interconnect design for AI

2026-08-19

Ams‑Osram launches MicroLED optical transmission simulation platform to accelerate high‑speed interconnect design for AI Data Centers


latest company news about Ams‑Osram launches MicroLED optical transmission simulation platform to accelerate high‑speed interconnect design for AI 0

Fueled by explosive growth in AI demands, massive capital investment is pouring into data‑center infrastructure. Both training state‑of‑the‑art large models and running inference workloads for AI agents such as ChatGPT and Claude require massive computing power.

An AI data center consists of networks built by interconnecting processors and storage devices. Currently, copper‑based backplanes and cables dominate the links connecting these computing systems. Nevertheless, data centers worldwide are confronted with a severe shared challenge: network bandwidth, whether within or across servers, needs substantial improvement.

From a technical perspective, the conventional approach is to keep boosting signal transmission frequencies over copper‑wire networks. This method, however, is approaching physical limits. As transmission frequency rises, per‑bit energy consumption, heat generation and system complexity surge simultaneously. Hence, the industry is actively pursuing alternative solutions.

Against this backdrop, AMS‑OSRAM is developing an optical‑transmission solution based on microLED for high‑bandwidth data transfer within AI data centers. Traditional high‑bandwidth optical networks adopt a “fast‑but‑narrow” paradigm: data is transmitted over a single optical fiber at extremely high frequencies. By contrast, AMS‑OSRAM leverages a “slow‑but‑wide” architecture, employing hundreds to thousands of parallel‑operating microLED transmitters to replace single high‑speed, high‑power laser transmitters.

The microLED array alongside its drive‑and‑control technology has already achieved commercial deployment on AMS‑OSRAM’s EVIYOS™ platform for automotive lighting. This solidly demonstrates that the company has overcome manufacturing and co‑packaging challenges for high‑density microLED transmitters and digital control circuits.

Nevertheless, the microLED devices for data communication differ from those used in automotive lighting in both performance specifications and implementation approaches. At present, network‑equipment manufacturers aiming to drive innovation with microLED are still awaiting definitive verification results to validate the performance of such systems under real‑world operating conditions in data centers.

01
Simulation Model: Replicate Link‑Level Performance under Real‑World Operating Conditions

To this end, AMS‑OSRAM has developed a methodology for precise validation against industry‑specification requirements. The company has built a high‑fidelity system‑level simulation model capable of comprehensively evaluating the performance of microLED‑based communication links driven by real‑world AI data streams.

The AMS‑OSRAM system‑level model integrates time‑domain, frequency‑domain and bit‑error‑rate (BER) simulation capabilities. It can simulate the transmission characteristics of microLEDs, photodiodes, lenses and various types of optical fibers, as well as transmit equalizers, drivers, receive equalizers and amplifiers. In other words, this model fully covers all core building blocks of the electro‑optical front‑end for optical data links in AI servers.
latest company news about Ams‑Osram launches MicroLED optical transmission simulation platform to accelerate high‑speed interconnect design for AI 1
These device‑level models combine empirically‑measured microLED characteristic parameters with physical‑behavior models of other components. They enable comprehensive analysis of the impacts exerted by key electrical and optical parameters, including microLED radiation distribution, photodiode responsivity, as well as chromatic dispersion and modal dispersion of optical fibers. On this basis, the simulation model can accurately output key performance indicators (KPIs) such as bit‑error rate, energy‑per‑bit and signal‑to‑noise ratio.

Users can flexibly calculate various KPIs for designated operating conditions and component combinations. For instance, the model can intuitively demonstrate dynamic KPI variations triggered by changes in fiber length or fiber type. When optimizing toward a targeted bit‑error rate, users may also leverage the model to evaluate and trade‑off performance versus energy consumption.

Reverse derivation is also supported. Based on given system‑optimization requirements, the model can back‑calculate the specific specification requirements for each component within the link.

02
Ongoing Expansion: High‑Reliability Simulation Enables Accurate Solution Validation and Optimization

Currently, functionalities of this model are under continuous expansion. Future plans include incorporating simulation items for electrical and optical crosstalk between densely‑packed microLEDs and photodiodes, as well as thermal characteristics of packaged devices.
latest company news about Ams‑Osram launches MicroLED optical transmission simulation platform to accelerate high‑speed interconnect design for AI 2
For potential partners and customers including network‑equipment manufacturers, this means that before investing in the design and manufacturing of their first microLED‑based data interconnect hardware, they can conduct accurate solution validation and optimization through reliable system‑level link modeling.

With this simulation model, partners can precisely define the technical requirements for each individual component in the data link, evaluate the supply availability of required components, and fully verify the feasibility of the overall system design.