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XHP35.2 High Intensity High Density LED 18W High CRI 90 2700K-6500K White SMD Chip 12V Diode

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XHP35.2 High Intensity High Density LED 18W High CRI 90 2700K-6500K White SMD Chip 12V Diode

Brand Name:	Cree
Model Number:	XHP35.2
MOQ:	1000PCS
Packaging Details:	1000PCS/reef
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Color Temperature(CCT):

2700K (Soft Warm White), 3500K (Warm White), 5000K (Daylight), 6000K (Daylight Alert)

Luminous Efficacy(lm/w):

Color Rendering Index(Ra):

Color Temperature:

6500k

Emitting Color:

White

Input Voltage(V):

Luminous Intensity:

Operating Temperature(℃):

-40 - 85

Product Name:

XHP35.2

Maximum Drive Current:

1050 MA

Supply Ability:

1000000

Highlight:

XHP35.2 SMD LED Chip

6500K SMD LED Chip

XHP35.2 2700K LED Chip Diode

Product Description

XHP35.2 High Intensity & High Density LED 18W High CRI 90 2700K-6500K White SMD Chip 12V Diode

Highlights at a glance

The XLamp XHP35.2 LED is the next generation of Extreme High Power LEDs available in the XP footprint. Built on Cree LEDs latest high-power LED array technology, the XHP35.2 LED improves the voltage characteristics, efficacy and reliability of the XHP35 LED in the same 3.45 mm x 3.45 mm footprint. The new XHP35.2 LED provides an easy drop-in upgrade so that lighting manufacturers can achieve higher system LPW on existing XHP35 designs with minimal system redesign cost.

Available in 5-step EasyWhite bins at 2200 K-5700 K CCT, 3-step at 2200 K-5000 K CCT & 2-step EasyWhite bins at 2700 K-5000 K CCT

Available in ANSI white bins at 2700 K to 7000 K CCT

Available in standard, 70, 80, 90, and 95 CRI minimum options

Maximum drive current: 6000 mA (3 V), 3000 mA (6 V), 1500 mA (12 V)

Wide viewing angle - High Density:135Â°, High Intensity: 120Â°

XLamp®XHP35.2 LEDs

PRODUCT DESCRIPTION

The XLamp® XHP35.2 LED is the next generation of Extreme High

Power LEDs available in the XP footprint. Built on Cree LED’s latest

high-power LED array technology, the XHP35.2 LED improves the

voltage characteristics, efficacy and reliability of the XHP35 LED

in the same 3.45 mm x 3.45 mm footprint. The new XHP35.2 LED

provides an easy drop-in upgrade so that lighting manufacturers

can achieve higher system LPW on existing XHP35 designs with

minimal system redesign cost.

The XHP35.2 LED offers a high-intensity option. In this document,

the term XHP35.2 denotes the XHP35.2 LED without regard to high

density or high intensity. The terms High Density and High Intensity

are used when necessary to differentiate the performance of the

two options.

FEATURES

• Available in white, and in 12-V version or 3-V & 6-V version

(3-V/6‑V is configurable by PCB layout)

• Available in 5-step EasyWhite® bins at 2700 K—5700 K CCT and

3-step & 2‑step EasyWhite bins at 2700 K—4000 K CCT

• Available in ANSI white bins at 2700 K to 7000 K CCT

• Available in standard, 70, 80, 90, and 95 CRI minimum options

• Binned at 85 °C

• Maximum drive current: 6000 mA (3 V), 3000 mA (6 V),

1500 mA (12 V)

• Low thermal resistance: 0.7 °C/W

• Wide viewing angle - High Density:135°, High Intensity: 120°

• Unlimited floor life at ≤ 30 ºC/85% RH

• Reflow solderable - JEDEC J‑STD‑020C

• RoHS and REACH compliant

• UL® recognized component (E349212)

This table comprehensively outlines the thermal, optical, and electrical characteristics of a multi-voltage LED device (available in 3-V, 6-V, and 12-V configurations), with two optical variants (High Density and High Intensity). For thermal performance, the thermal resistance from junction to solder point is a typical 0.7 °C/W, measured per the JEDEC JESD51-14 standard, enabling highly efficient heat dissipation for stable high-current operation. Optically, the High Density variant offers a wider viewing angle (FWHM) of 135 degrees, while the High Intensity variant provides a narrower 120-degree beam angle, tailored to different illumination distribution needs.

The temperature coefficient of voltage varies by configuration: −1.25 mV/°C (typical) for 3 V, −2.5 mV/°C (typical) for 6 V (calculated reference data), and −5 mV/°C (typical) for 12 V, reflecting how forward voltage decreases with rising temperature across different voltage setups. All configurations carry an ESD withstand voltage classification of Class 3B per HBM (Mil-Std-883D), ensuring robust electrostatic discharge protection. In terms of electrical limits, the DC forward current is 6000 mA (maximum) for 3 V, 3000 mA (maximum) for 6 V (reference data), and 1500 mA (maximum) for 12 V, with a universal maximum reverse voltage of 1 V across all setups.

Forward voltage is specified at defined currents and a junction temperature of 85 °C: for the 3-V configuration at 1400 mA, the typical forward voltage is 2.75 V (max 3.05 V); for the 6-V configuration at 700 mA (reference data), it is 5.5 V (max 6.1 V); and for the 12-V configuration at 350 mA, it is 11 V (max 12.2 V). Finally, the maximum LED junction temperature is uniformly set at 150 °C, establishing the critical thermal threshold for safe and reliable long-term operation across all voltage and optical variants.

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products details

XHP35.2 High Intensity High Density LED 18W High CRI 90 2700K-6500K White SMD Chip 12V Diode

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips

TSLC Semileds LED Lamp Beads

High Power LED Chip

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips