XHP70.3 High Power LED Chip 7070 Size Algainp Material White 3000K 5000K 6500K 43W Ra90 Outdoor Lighting

XHP70.3 High Power LED Chip 7070 Size Algainp Material White 3000K/5000K/6500K 43W Ra90 Outdoor Lighting

The XLamp® XHP70.3 LEDs are the third generation of Extreme High Power LEDs that deliver the best lumen density, reliability and optical control available in their size. By leveraging the XHP family advantages, lighting manufacturers can significantly reduce their system cost by using fewer optics, PCBs and heat sinks than possible with standard LEDs.

The third generation XHP family LEDs deliver improved optical performance versus the previous generations, with higher intensity through optics than the second generation and the XHP family’s highest on-axis intensity.

XLamp XHP70.3 LEDs are optimized for outdoor and premium indoor lighting applications that require large amounts of light output from small luminaires, such as stadium, outdoor area and architectural spotlight.

FEATURES

• Available in white, configurable to 6 V or 12 V by PCB layout

• Available in 5-step EasyWhite® bins at 3000 K to 5000 K CCT, 3-step EasyWhite bins at 2700 K to 5000 K and 2-step EasyWhite bins at 2700 K to 4000 K CCT

• Available in ANSI white bins at 3000 K to 7000 K CCT

• Broadcast color option at 5700 K provides maximum performance for TV events that require extremely high TLCI

• Available in standard, 70-, 80-, and 90-minimum CRI options

• Binned at 85 °C

• Maximum drive current: 7200 mA (6 V), 3600 mA (12 V)

• Low thermal resistance: 0.2 °C/W

• Wide viewing angle: 120° (HD), 115 (HI)

• Unlimited floor life at ≤ 30 ºC/85% RH

• Reflow solderable - JEDEC J-STD-020C

• RoHS and REACh compliant

This document details the comprehensive characteristics of XHP70.3 LEDs, which are tested and binned in production across 3-V and 12-V configurations, with pad layout options available in the Mechanical Dimensions section on page 37. Thermally, the junction-to-solder-point thermal resistance features an extremely low typical value of 0.2 °C/W, measured in accordance with the JEDEC JESD51-14 standard (refer to the Thermal Resistance Measurement application note for further details). Optically, the viewing angle (FWHM) is typically 120 degrees for the High Density variant and 115 degrees for the High Intensity variant. The temperature coefficient of voltage varies by configuration: -1.25 mV/°C for the 3-V setting, -2.5 mV/°C for the 6-V configuration (calculated reference data), and -5.0 mV/°C for the 12-V version. For electrostatic discharge (ESD) reliability, the device is rated Class 3B (HBM per Mil-Std-883D). Electrically, the DC forward current limits are set at 14,400 mA for the 3-V configuration, 7200 mA for the 6-V variant, and 3600 mA for the 12-V version, with a maximum reverse voltage of 1 V applicable across all setups. Forward voltage specifications are provided under specific test conditions at 85 °C: for the 3-V configuration at 4200 mA, the typical forward voltage is 2.8 V with a maximum of 3.05 V; for the 6-V configuration at 2100 mA (calculated reference data), the typical value is 5.6 V with a maximum of 6.1 V; and for the 12-V configuration at 1050 mA, the typical forward voltage is 11.2 V with a maximum of 12.2 V. It is explicitly noted that data for the 6-V configuration is calculated and for reference only, and the maximum LED junction temperature for the device is 150 °C, defining the upper operational temperature limit.