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High Luminous XHP70.3 High Power LED Diode Lamp White 3535 5050 2835 Aluminum Substrate SMD Solder Chip

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High Luminous XHP70.3 High Power LED Diode Lamp White 3535 5050 2835 Aluminum Substrate SMD Solder Chip

Brand Name:	Cree
Model Number:	XHP70.3
MOQ:	10
Price:	CN¥41.48-43.95
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Color Temperature(CCT):

2700k-6500k

Luminous Efficacy(lm/w):

Color Rendering Index(Ra):

Emitting Color:

White

Woking Hours:

50000

Operating Temperature(℃):

-40 - 85

Storage Temperature(℃):

-40 - 100

Type:

High Power Led

Viewing Angle(°):

Product Name:

XHP70.3

Supply Ability:

1000000

Highlight:

XHP70.3 SMD LED Chip

5050 SMD LED Chip

XHP70.3 3535 LED Chip Diode

Product Description

High Luminous XHP70.3 High Power LED Diode Lamp White 3535 5050 2835 Aluminum Substrate SMD Solder Chip

XLamp®XHP70.3 LEDs

PRODUCT DESCRIPTION

The XLamp® XHP70.3 LEDs are the third generation of Extreme

High Power LEDs that deliver the best lumen density, reliability and

optical control available in their size. By leveraging the XHP family

advantages, lighting manufacturers can significantly reduce their

system cost by using fewer optics, PCBs and heat sinks than

possible with standard LEDs.

The third generation XHP family LEDs deliver improved optical

performance versus the previous generations, with higher intensity

through optics than the second generation and the XHP family’s

highest on-axis intensity.

XLamp XHP70.3 LEDs are optimized for outdoor and premium

indoor lighting applications that require large amounts of light

output from small luminaires, such as stadium, outdoor area and

architectural spotlight.

FEATURES

• Available in white, and in 3-V version or 6-V & 12-V version

(6-V/12-V is configurable by PCB layout)

• Available in 5-step EasyWhite® bins at 3000 K to 5000 K

CCT, 3-step EasyWhite bins at 2700 K to 5000 K and 2-step

EasyWhite bins at 2700 K to 4000 K CCT

• Available in ANSI white bins at 3000 K to 7000 K CCT

• Broadcast color option at 5700 K provides maximum

performance for TV events that require extremely high TLCI

• Available in standard, 70-, 80-, 90-, and 95-minimum CRI options

• Binned at 85 °C

• Maximum drive current: 14,400 mA (3V), 7200 mA (6 V),

3600 mA (12 V)

• Low thermal resistance: 0.2 °C/W

• Wide viewing angle: 120° (HD), 115 (HI)

• Unlimited floor life at ≤ 30 ºC/85% RH

• Reflow solderable - JEDEC J-STD-020C

• RoHS and REACH compliant

• UL® recognized component (E349212)

This document details the core characteristics of XHP70.3 LEDs, which are tested and binned in 3-V and 12-V configurations (pad layout options are in the Mechanical Dimensions section on page 37). Thermally, the junction-to-solder-point thermal resistance is typically 0.2 °C/W, measured per the JEDEC JESD51-14 standard. Optically, the viewing angle (FWHM) is 120 degrees for the High Density variant and 115 degrees for the High Intensity variant. The temperature coefficient of voltage varies by configuration: -1.25 mV/°C (3 V), -2.5 mV/°C (6 V, calculated reference data), and -5.0 mV/°C (12 V). For reliability, the ESD withstand voltage is Class 3B (HBM per Mil-Std-883D). Electrically, the maximum DC forward current is 14,400 mA (3 V), 7,200 mA (6 V, calculated reference data), and 3,600 mA (12 V); the reverse voltage is 1 V. Forward voltage at 85 °C is typically 2.8 V (max 3.05 V) for 3 V @ 4,200 mA, 5.6 V (max 6.1 V) for 6 V @ 2,100 mA (calculated reference data), and 11.2 V (max 12.2 V) for 12 V @ 1,050 mA. The maximum LED junction temperature is 150 °C, with 6-V configuration data noted as calculated and for reference only.

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products details

High Luminous XHP70.3 High Power LED Diode Lamp White 3535 5050 2835 Aluminum Substrate SMD Solder Chip

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips

TSLC Semileds LED Lamp Beads

High Power LED Chip

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips