NSPW500DS NICHIA LED Chip White 27cd 3.2V Forward Voltage CIE 1931 Chromaticity

Nichia NSPW500DS RoHS White LED 27cd Luminous Intensity 3.2V Forward Voltage CIE 1931 Chromaticity

This LED has absolute max ratings: 30mA forward current, 100mA pulsed forward current, 5V reverse voltage, 105mW power dissipation, operating temp -30~85°C, storage temp -40~100°C, junction temp 100°C. At 20mA, typical forward voltage is 3.2V, luminous intensity 27cd, CIE 1931 chromaticity coordinates (0.31, 0.32).

This LED features a forward voltage range of 2.65–3.50V and a maximum reverse current of 50µA at 5V reverse voltage. Its luminous intensity is categorized into three ranks: W (31.0–44.0 cd), V (22.0–31.0 cd), and U (15.5–22.0 cd). Color ranks include a0, b1, b2, and c0 with specified CIE 1931 chromaticity coordinate ranges, all tested at 25°C. Measurement tolerances are ±3% for forward voltage, ±10% for luminous intensity, and ±0.01 for chromaticity coordinates. Shipments typically combine these ranks, with percentages determined by Nichia.

For a better thermal performance, copper alloy is used for the leadframe of the product.

Care must be taken for the soldering conditions and handling of the products after soldering.

Solder the LED no closer than 3mm from the base of the lens.

Soldering beyond the base of the tie bar is recommended.

Dip soldering and manual soldering must only be done once.

Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.

Do not apply any stress to the lead particularly when heated.

After soldering, the LED position must not be corrected.

After soldering, NO mechanical shock or vibration should be applied to LED lens

until the LEDs cool down to room temperature.

In order to avoid damage on the lens during cutting and clinching the leads,

it is not recommended to solder the LEDs directly on customer PCB without any gap between the lens and the board.

If it is unavoidable, customer is advised to check whether such soldering will not cause wire breakage or lens damage.

Direct soldering to double-sided PCBs must be avoided due to an increased effect of heat on the lens.

When it is necessary to clamp the LEDs to prevent soldering failure,

it is important to minimize the mechanical stress on the LEDs.

Cut the LED lead frames at room temperature. Cutting the lead frames at high temperature may cause failure of the LEDs.