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XHP50.3 High Density High Intensity 7000K CCT 5050 SMD LED Chip 18W 6V-12V White PCB Layout CREE

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XHP50.3 High Density High Intensity 7000K CCT 5050 SMD LED Chip 18W 6V-12V White PCB Layout CREE

Brand Name:	Cree
Model Number:	XHP50.3
MOQ:	10
Price:	CN¥23.66-33.71
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Color Temperature(CCT):

2700K (Soft Warm White), 3500K (Warm White), 4100K (Neutral White), 5000K (Daylight), 6000K (Daylight Alert)

Luminous Efficacy(lm/w):

Color Rendering Index(Ra):

Emitting Color:

White

Input Voltage(V):

6v-12v

Operating Temperature(℃):

-40 - 85

Storage Temperature(℃):

-40 - 100

Viewing Angle(°):

Product Name:

XHP50.3

Application:

Stadium, Outdoor Area And Architectural Spotlight

Supply Ability:

1000000

Highlight:

XHP50.3 CREE SMD LED

7000K CREE SMD LED

XHP50.3 5050 SMD LED Chip

Product Description

XHP50.3 High Density High Intensity 7000K CCT 5050 SMD LED Chip 18W 6V-12V White PCB Layout CREE

XLamp®XHP50.3 LEDs

PRODUCT DESCRIPTION

The XLamp XHP50.3 LEDs are the third generation of Extreme

High Power LEDs that deliver the best lumen density, reliability and

optical control available in their size. By leveraging the XHP family

advantages, lighting manufacturers can significantly reduce their

system cost by using fewer optics, PCBs and heat sinks than

possible with standard LEDs.

The third generation XHP family LEDs deliver improved optical

performance versus the previous generations, along with a new

High Intensity version of the XHP50. The XHP50.3 High Intensity

provides double the intensity for existing XHP50 designs.

XLamp XHP50.3 LEDs are optimized for outdoor and premium

indoor lighting applications that require large amounts of light

output from small luminaires, such as stadium, outdoor area and

architectural spotlight.

FEATURES

• Available in white, configurable to 3 V, 6 V or 12 V by PCB

layout

• Available in 5-step EasyWhite® bins at 3000 K to 5000 K

CCT, 3-step EasyWhite bins at 2700 K to 5000 K and 2-step

EasyWhite bins at 2700 K to 4000 K CCT

• Available in ANSI white bins at 3000 K to 7000 K CCT

• Available in standard, 70-, 80-, and 90-minimum CRI options

• Binned at 85 °C

• Maximum drive current: 6000 mA (3 V), 3000 mA (6 V),

1500 mA (12 V)

• Low thermal resistance: 0.4 °C/W

• Wide viewing angle: 120°

• Unlimited floor life at ≤ 30 ºC/85% RH

• Reflow solderable - JEDEC J‑STD‑020C

• RoHS and REACh compliant

• UL® recognized component (E349212)

This document details the key characteristics of XHP50.3 LEDs, which are tested and binned in production specifically for the 12-V configuration, with pad layout options available in the Mechanical Dimensions section on page 39. Thermally, the junction to solder point thermal resistance has a typical value of 0.4 °C/W, with measurements conducted per the JEDEC JESD51-14 standard. Optically, the viewing angle (FWHM) is a typical 120 degrees. In terms of voltage temperature coefficients, the values are -1.4 mV/°C for the 3-V configuration, -2.8 mV/°C for the 6-V configuration, and -5.6 mV/°C for the 12-V configuration. For electrostatic discharge (ESD) reliability, the device features a maximum ESD withstand voltage of 8000 V (HBM per Mil-Std-883D). Electrically, the DC forward current limits are 6000 mA for the 3-V configuration, 3000 mA for the 6-V configuration, and 1500 mA for the 12-V configuration, with a maximum reverse voltage of 1 V (for the 6-V configuration). Forward voltage specifications are provided under specific test conditions: at 2800 mA and 85 °C (3-V configuration), the typical forward voltage is 2.8 V with a maximum of 3.1 V; at 1400 mA and 85 °C (6-V configuration), the typical value is 5.6 V with a maximum of 6.2 V; and at 700 mA and 85 °C (12-V configuration), the typical forward voltage is 11.2 V with a maximum of 12.4 V. Notably, data for the 3-V and 6-V configurations is calculated and for reference only. The maximum LED junction temperature for the device is 150 °C, establishing the upper operational temperature limit.

product name	XHP50.3 LEDs
brand	cree
color	white
CCT	3000 K to 7000 K CCT
CRI	CRI70 ,CRI 80,CRI 90
Forward voltage	3 V, 6 V or 12 V by PCB layout
DC forward current	6000 mA (3 V), 3000 mA (6 V), 1500 mA (12 V)
POWER	18 Watt

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products details

XHP50.3 High Density High Intensity 7000K CCT 5050 SMD LED Chip 18W 6V-12V White PCB Layout CREE

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips

TSLC Semileds LED Lamp Beads

High Power LED Chip

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips