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3535 XHP35.2 CREE LED Chip High Density High Intensity LED Light 2700K-6000K White CRI Standard 18W 12V

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3535 XHP35.2 CREE LED Chip High Density High Intensity LED Light 2700K-6000K White CRI Standard 18W 12V

Brand Name:	Cree
Model Number:	XHP35.2
MOQ:	1000PCS
Packaging Details:	1000PCS/reef
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Color Temperature(CCT):

2700K (Soft Warm White), 3500K (Warm White), 5000K (Daylight), 6000K (Daylight Alert)

Luminous Efficacy(lm/w):

Emitting Color:

White

Input Voltage(V):

Woking Hours:

50000

Operating Temperature(℃):

-40 - 100

Viewing Angle(°):

Product Name:

XHP35.2

Chip Size:

Color:

White

Supply Ability:

1000000

Highlight:

XHP35.2 CREE LED Chip

XHP35.2 6000K LED Chip

XHP35.2 2700K LED Chip

Product Description

3535 XHP35.2 High-Density High-Intensity LED Light 2700K-6000K White CRI Standard 18W 12V 3-Year Warranty

XLamp®XHP35.2 LEDs

PRODUCT DESCRIPTION

The XLamp® XHP35.2 LED is the next generation of Extreme High

Power LEDs available in the XP footprint. Built on Cree LED’s latest

high-power LED array technology, the XHP35.2 LED improves the

voltage characteristics, efficacy and reliability of the XHP35 LED

in the same 3.45 mm x 3.45 mm footprint. The new XHP35.2 LED

provides an easy drop-in upgrade so that lighting manufacturers

can achieve higher system LPW on existing XHP35 designs with

minimal system redesign cost.

The XHP35.2 LED offers a high-intensity option. In this document,

the term XHP35.2 denotes the XHP35.2 LED without regard to high

density or high intensity. The terms High Density and High Intensity

are used when necessary to differentiate the performance of the

two options.

FEATURES

• Available in white, and in 12-V version or 3-V & 6-V version

(3-V/6‑V is configurable by PCB layout)

• Available in 5-step EasyWhite® bins at 2700 K—5700 K CCT and

3-step & 2‑step EasyWhite bins at 2700 K—4000 K CCT

• Available in ANSI white bins at 2700 K to 7000 K CCT

• Available in standard, 70, 80, 90, and 95 CRI minimum options

• Binned at 85 °C

• Maximum drive current: 6000 mA (3 V), 3000 mA (6 V),

1500 mA (12 V)

• Low thermal resistance: 0.7 °C/W

• Wide viewing angle - High Density:135°, High Intensity: 120°

• Unlimited floor life at ≤ 30 ºC/85% RH

• Reflow solderable - JEDEC J‑STD‑020C

• RoHS and REACH compliant

• UL® recognized component (E349212)

This document details the characteristics of XLamp XHP35.2 LEDs, which are tested and binned in production in 3-V and 12-V configurations, with pad layout options available in the Mechanical Dimensions section on page 40. Thermally, the junction-to-solder-point thermal resistance is typically 0.7 °C/W, measured per the JEDEC JESD51-14 standard (further details can be found in the Thermal Resistance Measurement application note). Optically, the viewing angle (FWHM) is 135 degrees for the High Density variant and 120 degrees for the High Intensity variant. The temperature coefficient of voltage varies by configuration: -1.25 mV/°C for 3 V, -2.5 mV/°C for 6 V (calculated reference data), and -5 mV/°C for 12 V. For ESD reliability, the device is rated Class 3B (HBM per Mil-Std-883D). DC forward current limits are 6000 mA for 3 V, 3000 mA for 6 V (calculated reference data), and 1500 mA for 12 V, with a maximum reverse voltage of 1 V. Forward voltage specifications are provided under specific test conditions at 85 °C: for the 3-V configuration at 1400 mA, the typical forward voltage is 2.75 V (max 3.05 V); for the 6-V configuration at 700 mA (calculated reference data), the typical value is 5.5 V (max 6.1 V); and for the 12-V configuration at 350 mA, the typical forward voltage is 11 V (max 12.2 V). It is noted that data for the 6-V configuration is calculated and for reference only, and the maximum LED junction temperature is 150 °C, defining the upper operational temperature limit.

product name	XHP35.2
brand	cree
chip size	3535
CCT	2700 K—5700 K CCT
CRI	80,90,95
COLOR	white
power	18 Watt

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products details

3535 XHP35.2 CREE LED Chip High Density High Intensity LED Light 2700K-6000K White CRI Standard 18W 12V

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips

TSLC Semileds LED Lamp Beads

High Power LED Chip

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips