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4 1 RGBW XP-L High Density High Intensity 3535 SMD High Power LED CREEs Chip Diode Red Green Blue White

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4 1 RGBW XP-L High Density High Intensity 3535 SMD High Power LED CREEs Chip Diode Red Green Blue White

Brand Name:	Cree
Model Number:	XP-L
MOQ:	1000PCS
Price:	$3.68-5.24
Packaging Details:	1000PCS/reef
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Color Temperature(CCT):

2700K (Soft Warm White), 3500K (Warm White), 4100K (Neutral White), 5000K (Daylight), 6000K (Daylight Alert)

Luminous Efficacy(lm/w):

Warranty(Year):

3-Year

Emitting Color:

Input Voltage(V):

Woking Hours:

50000

Luminous Intensity:

Storage Temperature(℃):

-40 - 100

Product Name:

XP-L COLOR

ESD Withstand Voltage:

Class 3B

Supply Ability:

1000000

Highlight:

3535 CREE LED Diode

Green CREE LED Diode

Red CREE LED Diode

Product Description

4 1 RGBW XP-L High Density High Intensity 3535 SMD High Power LED CREEs Chip Diode Red Green Blue White

XLamp®XP-L Color LEDs

PRODUCT DESCRIPTION

XLamp® XP-L Color LEDs are multi-color

RGBW LEDs that deliver the combination

of high lumen output and great color

mixing in a small 3.45 x 3.45 mm package.

The XLamp XP-L Color LEDs feature the

smallest possible distance between LED

die, creating a small optical source for

excellent optical control and efficient color

mixing.

XLamp XP-L Color LEDs are optimized

for all high-performance RGBW lighting

applications, including color-changing,

stage, architectural and entertainment.

The XP-L Color LED offers high-density and

high-intensity options. In this document,

the term XP-L Color denotes the XP-L

Color LED without regard to high density or

high intensity. The terms High Density and

High Intensity are used when necessary to

differentiate the performance of the two

options.

FEATURES

• Available in red, green, blue and white in

a single package

• Maximum drive current per LED die: 1 A

• Individually addressable LEDs

• Reflow solderable – JEDEC J-STD-020

• Electrically neutral thermal path

• RoHS and REACH compliant

• UL® recognized component (E349212)

This document details the characteristics of the XLamp XP-L Color LED package, measured with all LED dies active and each die driven independently at 700 mA. For the complete package, the thermal resistance from junction to solder point is a typical 1.4 °C/W, with viewing angles (FWHM) of 110 degrees for High Density variants and 120 degrees for High Intensity variants; ESD withstand voltage (HBM per Mil-Std-883D) is classified as Class 3B, and the maximum allowable LED junction temperature is 150 °C. For individual LED dies, the temperature coefficient of voltage varies: -1.7 mV/°C for red, and -1.1 mV/°C for green, blue, and white. The maximum DC forward current for red, green, blue, and white dies is 1000 mA. At 700 mA and 25 °C, forward voltage values are: 2.7 V typical (3.2 V max) for red, 3.4 V typical (3.7 V max) for green, and 3.3 V typical (3.6 V max) for blue and white.

product name	XP-L COLOR LED
brand	cree
color	RGBW
DC forward current - red, green, blue, whit	1A
Viewing angle (FWHM) - High Density	110
Viewing angle (FWHM) - High Intensity	120
POWER	13 Watt

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products details

4 1 RGBW XP-L High Density High Intensity 3535 SMD High Power LED CREEs Chip Diode Red Green Blue White

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips

TSLC Semileds LED Lamp Beads

High Power LED Chip

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips