Highest Performing High-Density 3535 LED XPL2 CREEs 10W CRI90 SMD CHIP White Roadway Outdoor Area
XLamp®XP-L2 LEDs
PRODUCT DESCRIPTION
The XLamp® XP-L2 LED is Cree LED’s
highest performing high-density discrete
LED. Leveraging key elements of Cree LED’s
SC5 Technology® Platform, the high-power
XP-L2 LED improves the lumen density,
voltage characteristics and reliability of the
XP-L LED in the same 3.45 mm x 3.45 mm
package. This best-in-class performance
enables lighting manufacturers to deliver
differentiated solutions at lower system
costs for applications such as roadway,
outdoor area, spot and high-bay lighting.
FEATURES
• Available in white, 70-CRI white, 80-CRI
white and 90-CRI white
• Broadcast color option at 5700 K
provides maximum performance for TV
events that require extremely high TLCI
• ANSI-compatible chromaticity bins
• Binned at 85 °C
• Maximum drive current: 3000 mA
• Low thermal resistance: 2.2 °C/W
• Wide viewing angle: 125°
• Unlimited floor life at ≤ 30 ºC/85% RH
• Reflow solderable - JEDEC J‑STD‑020C
• Electrically neutral thermal path
• RoHS and REACh compliant
• UL® recognized component (E349212)
This document details the core electrical, thermal, and optical characteristics of the LED device. The thermal resistance from junction to solder point is a typical 2.2 °C/W, while the viewing angle (FWHM) measures 125 degrees typically. The temperature coefficient of voltage is -1.3 mV/°C, indicating how the forward voltage changes with temperature. For reliability, the ESD withstand voltage (HBM per Mil-Std-883D) is rated at a maximum of 8000 V, and the maximum DC forward current is 3000 mA, with a reverse voltage limit of 1 V. At a test condition of 1050 mA and 85 °C, the forward voltage has a typical value of 2.79 V and a maximum of 3.10 V. The maximum allowable LED junction temperature is 150 °C, defining the upper operational temperature limit for the device.