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CREE LED Chip

Lamp Bead 5050 Size XML XML2 XML3 XMLDCL Color White Cool Warm RGBW SMD LED CREEs Chip Diode 10 W

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High Power LED Chip

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Lamp Bead 5050 Size XML XML2 XML3 XMLDCL Color White Cool Warm RGBW SMD LED CREEs Chip Diode 10 W

Brand Name:	Cree
Model Number:	XML
MOQ:	1000PCS
Price:	CN¥23.25-28.62
Packaging Details:	1000PCS/reef
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Luminous Efficacy(lm/w):

162

Warranty(Year):

3-Year

Color Rendering Index(Ra):

Color Temperature:

2700k-8300k

Emitting Color:

White

Input Voltage(V):

Luminous Intensity:

300

Storage Temperature(℃):

-40 - 100

Product Name:

XM-L

Low Thermal Resistance:

2.5 °C/W

Supply Ability:

1000000

Highlight:

XML3 CREE LED Diode

XML3 5050 CREE SMD LED

10W CREE SMD LED

Product Description

Lamp Bead 5050 Size XML XML2 XML3 XMLDCL Color White Cool Warm RGBW SMD LED CREEs Chip Diode 10 W

Highlights at a glance

XLamp XM-L LeDs can enable LeD light into new applications that require tens of thousands of lumens, such as high bay and high-output area lighting. The XM-L is also the ideal choice for lighting applications where high light output and maximum efficacy are required, such as LeD light bulbs, outdoor lighting, portable lighting, indoor lighting and solar powered lighting.

Maximum drive current: 3000 mA

Low thermal resistance: 2.5 Â°C/W

Maximum junction temperature: 150 Â°C

Viewing angle: 125Â°

Available in cool white, 80-CRI minimum neutral white and 80-CRI, 85-CRI and 90-CRI warm white

CREE XML 5050 package 10W LED chip diode 5000k 6500k 3000k 3500k 5700k warm white color

Cree® XLamp® XM-L LEDs

PRODUCt DESCRIPTION

The XLamp® XM-L LeD is the industry’s

highest performance, single-die white

lighting-class LeD. The XLamp XM-L LeD

is 20% more efficient than the XLamp

XP-G LeD at the same current, and can

deliver 1000 lumens with 100 lumens per

watt efficacy. The XLamp XM-L LED offers

Cree’s industry-leading features: wide

viewing angle, symmetrical package,

unlimited floor life and electrically neutral

thermal path.

XLamp XM-L LeDs can enable LeD light

into new applications that require tens

of thousands of lumens, such as high

bay and high-output area lighting. The

XM-L is also the ideal choice for lighting

applications where high light output and

maximum efficacy are required, such as

LeD light bulbs, outdoor lighting, portable

lighting, indoor lighting and solar

powered lighting.

FEATURES

• Maximum drive current: 3000 mA

• Low thermal resistance: 2.5 °C/W

• Maximum junction temperature:

150 °C

• Viewing angle: 125°

• Available in cool white, 80-CRI

minimum neutral white and 80-CRI,

85-CRI and 90-CRI warm white

• ANSI-compatible chromaticity bins

• Unlimited floor life at

≤ 30 ºC/85% RH

• Reflow solderable - JEDEC

J-STD-020C

• electrically neutral thermal path

• RoHS and REACh compliant

• UL® recognized component

(E349212)

This table outlines the core thermal, optical, and electrical characteristics of a high-power LED device, defining its operational boundaries and performance metrics. For thermal management, the thermal resistance from junction to solder point is a typical 2.5 °C/W, which governs the device’s heat dissipation efficiency and thermal stability under high-current operation. Optically, the LED features a typical viewing angle (FWHM) of 125 degrees, delivering a wide light distribution pattern suitable for broad illumination applications. The temperature coefficient of voltage is −2.1 mV/°C (typical), indicating the linear rate at which forward voltage decreases as operating temperature rises, a critical parameter for thermal design and voltage regulation in high-power systems.

For electrostatic protection, the ESD withstand voltage is rated at a maximum of 8000 V per HBM (Mil-Std-883D), ensuring robust resilience against electrostatic discharge events that could damage the device during handling or operation. In terms of electrical limits, the DC forward current is capped at a maximum of 3000 mA, making it suitable for high-brightness lighting applications, while the reverse voltage is restricted to a maximum of 5 V to prevent damage from reverse bias conditions.

Forward voltage is specified across multiple current levels: at 700 mA, the typical forward voltage is 2.9 V (max 3.5 V); at 1500 mA, it rises to 3.1 V; and at the full rated current of 3000 mA, it peaks at 3.35 V. Finally, the maximum LED junction temperature is uniformly set at 150 °C, establishing the critical thermal threshold for safe and reliable long-term operation across the device’s full current range, ensuring it remains within its safe operating area under all specified conditions.

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products details

Lamp Bead 5050 Size XML XML2 XML3 XMLDCL Color White Cool Warm RGBW SMD LED CREEs Chip Diode 10 W

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips

TSLC Semileds LED Lamp Beads

High Power LED Chip

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips