Mid Power High Efficacy 154lm/W CCT 2200K-8300K 70 CRI 90 XHG Warm White 3030 SMD LED Chip Diode 1W CREE
XLamp®XH-G LED
PRODUCT DESCRIPTION
Unlike common plastic packages, XLamp
XH LEDs use a ceramic package to
deliver the unique combination of high
performance and reliability not available
elsewhere in mid-power LEDs. The
ceramic-based XH LEDs are designed to
deliver the long L70 lifetimes of Cree LED’s
other high-power LEDs, such as XP or XT
LEDs, as well as industry-leading LED
efficacy levels.
Optimized for fluorescent replacement
lighting applications, such as troffers and
panel lights, where high efficacy, long
lifetime and smooth appearance are critical,
the XH LEDs allow lighting manufacturers
to offer products that meet the lifetime
expectations of LED technology.
FEATURES
• Package size: 3.0 X 3.0 mm
• Available in white (2200 K and
2600 K - 8300 K), 70-minimum CRI cool
white, 80-minimum CRI white and 85-
and 90-minimum CRI warm white
• 350 mA maximum drive current
• Viewing angle: 130°
• Reflow solderable - JEDEC J‑STD‑020C
compatible
• Unlimited floor life at ≤ 30 °C/85% RH
• RoHS and REACh compliant
• UL® recognized component (E349212)
This document outlines the core thermal, optical, electrical, and reliability characteristics of the LED device. The thermal resistance from junction to solder point is a typical 20 °C/W, while the viewing angle (FWHM) measures 130 degrees typically. The temperature coefficient of voltage is -1.2 mV/°C, indicating the rate at which forward voltage changes with temperature fluctuations. For electrostatic discharge (ESD) reliability, the device has a maximum withstand voltage of 8000 V (HBM per Mil-Std-883D). The maximum DC forward current is 350 mA, with a maximum reverse voltage of 1 V. At a test condition of 65 mA and 25 °C, the forward voltage has a typical value of 2.9 V and a maximum of 3.4 V. The maximum allowable LED junction temperature is 150 °C, defining the upper operational temperature limit of the device.