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XB-H 2525 SMD LEDs Chip Lighting 5W 1500mA 3V 110 Viewing Angle White High CRI 80-90 InGaN Diode

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XB-H 2525 SMD LEDs Chip Lighting 5W 1500mA 3V 110 Viewing Angle White High CRI 80-90 InGaN Diode

Brand Name:	Cree
Model Number:	XB-H
MOQ:	1000PCS
Price:	CN¥8.53-11.77
Packaging Details:	1000PCS/reef
Payment Terms:	T/T

Detail Information

Product Description

Detail Information

Place of Origin:

Luminous Efficacy(lm/w):

Color Rendering Index(Ra):

80-90

Color Temperature(CCT):

2700K (Soft Warm White), 3500K (Warm White), 5000K (Daylight), 6000K (Daylight Alert)

Emitting Color:

White

Forward Current:

1500 MA

Input Voltage(V):

Operating Temperature(℃):

-40 - 85

Type:

Smd LED

Viewing Angle(°):

Product Name:

Supply Ability:

1000000

Highlight:

CRI80 SMD LED Chip

2525 SMD LED Chip

5W SMD LED

Product Description

XB-H 2525 SMD LEDs Chip Lighting 5W 1500mA 3V 110 Viewing Angle White High CRI 80-90 InGaN Diode

XLamp®XB-H LEDs

PRODUCT DESCRIPTION

The XLamp® XB-H LED delivers a

breakthrough combination of lumen output

and efficacy in a small package. Delivering

more than 500 lumens at 1.5 A, 25 °C in a

2.45 mm2 package, the XB-H LED offers

triple the lumen density of competing

high‑power LEDs to significantly increase

the performance of today’s lighting designs.

The XB-H LED joins a new generation of

directionally optimized LEDs that offers

the industry’s highest optical control factor

(OCF), a measurement of how LED size and

performance benefit directional lighting

applications. High‑OCF LEDs enable

lighting manufacturers to improve the

performance of any lighting design, create

smaller and less expensive systems, and

develop new lighting solutions that were

previously not possible.

FEATURES

• Available in white, outdoor white and

80-, 85- and 90-CRI white

• ANSI-compatible chromaticity bins

• Binned at 85 °C

• Maximum drive current: 1500 mA

• Low thermal resistance: 4 °C/W

• Wide viewing angle: 110°

• Unlimited floor life at ≤ 30 ºC/85% RH

• Reflow solderable - JEDEC J‑STD‑020C

• Electrically neutral thermal path

• RoHS and REACh compliant

• UL® recognized component (E349212)

This document details the core thermal, optical, electrical, and reliability characteristics of the LED device. The thermal resistance from junction to solder point is a typical 4 °C/W, while the viewing angle (FWHM) measures 110 degrees typically. The temperature coefficient of voltage is -1.3 mV/°C, indicating the rate at which forward voltage changes with temperature fluctuations. For electrostatic discharge (ESD) reliability, the device has a maximum withstand voltage of 8000 V (HBM per Mil-Std-883D). The maximum DC forward current is 1500 mA, with a maximum reverse voltage of 1 V. Forward voltage specifications are provided at 85 °C across multiple current levels: at 700 mA, the typical forward voltage is 2.86 V with a maximum of 3.3 V; at 1000 mA, the typical value is 2.95 V; and at 1500 mA, the typical forward voltage is 3.08 V. The maximum allowable LED junction temperature is 150 °C, defining the upper operational temperature limit of the device.

product name	XB-H
brand	cree
chip size	2525
color	white
Maximum drive current	1500 mA
power	5 Watt

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products details

XB-H 2525 SMD LEDs Chip Lighting 5W 1500mA 3V 110 Viewing Angle White High CRI 80-90 InGaN Diode

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips

TSLC Semileds LED Lamp Beads

High Power LED Chip

OSRAM LED Chip

CREE LED Chip

ST IC Chips

TI Chips

Bridgelux LED Chip

Infineon Chip

LUMINUS LED Chip

LED Lamp Beads

SAMSUNG IC Chips

Micron Chips

SK Hynix Chips

Lumileds LED Chip

SAMSUNG LED Chip

SEOUL LED Chip

NICHIA LED Chip

NeXperia Chips

ONsemi Chips

ADI Chips