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XP-L High Power LED 10W High Intensity 3535 Chip 3000mA 3V Ra90

XP-L High Power LED 10W High Intensity 3535 Chip 3000mA 3V Ra90

Brand Name: Cree
Model Number: XP-L
MOQ: 1000PCS
Price: $5.04-6.42
Packaging Details: 1000PCS/reef
Payment Terms: T/T
Detail Information
Place of Origin:
CN
Color Temperature(CCT):
2700K (Soft Warm White), 3500K (Warm White), 5000K (Daylight), 6000K (Daylight Alert)
Luminous Efficacy(lm/w):
120
Color Rendering Index(Ra):
90
Emitting Color:
White
Input Voltage(V):
3 V
Operating Temperature(℃):
-40 - 85
Storage Temperature(℃):
-40 - 100
Viewing Angle(°):
115
Product Name:
XP-L
Maximum Drive Current:
3000 MA
Supply Ability:
1000000
Highlight:

Ra90 LED Chip

,

3535 LED Chip

,

10W LED Chip

Product Description

XP-L High Power LED 10W High Intensity 3535 Chip 3000mA 3V Ra90 5-Year Warranty

 

XLamp®XP-L LEDs

 

PRODUCT DESCRIPTION
XLamp® XP-L LEDs are available in two
versions: High Density (HD) and High
Intensity (HI).
The XLamp XP-L HD LED is the highest
performing discrete in Cree LED’s HD class
of LEDs, delivering the next generation of
lumen output and efficacy in the compact
3.45 mm x 3.45 mm XP footprint. Cree LED’s
HD LEDs, optimized to deliver maximum
lumen output in a small form factor, enable
lighting manufacturers to improve the
performance of any lighting design, create
smaller and less expensive systems, and
develop new lighting solutions that were
previously not possible.
The XLamp XP-L HI LED is the first of Cree
LED’s new class of high-intensity LEDs
optimized to deliver maximum candela
through secondary optics. The XP-L HI LED
delivers 120 percent more candela than
the XP-L HD LED through the same optic.
The XP-L HI LED leverages the industry’s
highest single-die performance and a
new innovative primary optic design that
radically reduces the optical source size to
deliver both lumens and intensity.
 
FEATURES
• Available in white, 70-CRI white, 80-CRI
white, and 90-CRI white
• ANSI-compatible chromaticity bins
• Binned at 85 °C
• Maximum drive current: 3000 mA
• Low thermal resistance: 0.5 °C/W
• Wide viewing angle: 125° (XP-L HD),
115° (XP-L HI)
• Unlimited floor life at ≤ 30 ºC/85% RH
• Reflow solderable - JEDEC J‑STD‑020C
• Electrically neutral thermal path
• RoHS and REACH compliant
• UL® recognized component (E349212)
 
This document details the core thermal, optical, electrical, and reliability characteristics of the LED device, with thermal resistance from junction to solder point measured at a typical 0.5 °C/W per the JEDEC JESD51-14 standard (further details available in the Thermal Resistance Measurement application note). Optically, the viewing angle (FWHM) is 125 degrees for the XP-L High Density variant and 115 degrees for the XP-L High Intensity variant. The temperature coefficient of voltage is -1.3 mV/°C, indicating the rate at which forward voltage changes with temperature fluctuations. For ESD reliability, the device is rated Class 3B (HBM per Mil-Std-883D), with a maximum DC forward current of 3000 mA and a maximum reverse voltage of 1 V. At a test condition of 1050 mA and 85 °C, the forward voltage has a typical value of 2.79 V and a maximum of 3.25 V. The maximum allowable LED junction temperature is 150 °C, defining the upper operational temperature limit of the device.

XP-L High Power LED 10W High Intensity 3535 Chip 3000mA 3V Ra90

product name  XPL LEDs
brand  CREE
chip size  3535
color  white
Maximum drive current 3000 mA
power 10 Watt

 

 

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XP-L High Power LED 10W High Intensity 3535 Chip 3000mA 3V Ra90XP-L High Power LED 10W High Intensity 3535 Chip 3000mA 3V Ra90XP-L High Power LED 10W High Intensity 3535 Chip 3000mA 3V Ra90XP-L High Power LED 10W High Intensity 3535 Chip 3000mA 3V Ra90