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CREE LED Chip
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5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White

5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White

Brand Name: Cree
Model Number: XHP50.3
MOQ: 10
Payment Terms: T/T
Detail Information
Place of Origin:
CN
Luminous Efficacy(lm/w):
170
Color Rendering Index(Ra):
80
Color Temperature:
2700K-7000K
Emitting Color:
White
Input Voltage(V):
3V/6V/12V
Operating Temperature(℃):
-40 - 85
Storage Temperature(℃):
-40 - 100
Viewing Angle(°):
120
Product Name:
XHP50.3
Application:
Stadium, Outdoor Area And Architectural Spotlight
Supply Ability:
1000000
Highlight:

XHP50.3 CREE LED Diode

,

XHP50.3 5050 LED Chip Diode

,

White CREE LED Diode

Product Description

5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White

 

XLamp®XHP50.3 LEDs
 
PRODUCT DESCRIPTION
The XLamp® XHP50.3 LEDs are the third generation of Extreme
High Power LEDs that deliver the best lumen density, reliability and
optical control available in their size. By leveraging the XHP family
advantages, lighting manufacturers can significantly reduce their
system cost by using fewer optics, PCBs and heat sinks than
possible with standard LEDs.
The third generation XHP family LEDs deliver improved optical
performance versus the previous generations, along with a new
High Intensity version of the XHP50. The XHP50.3 High Intensity
LED provides double the intensity for existing XHP50 designs.
XLamp XHP50.3 LEDs are optimized for outdoor and premium
indoor lighting applications that require large amounts of light
output from small luminaires, such as stadium, outdoor area and
architectural spotlight.
 
FEATURES
• Available in white, and in 3-V version or 6-V & 12-V version
(6-V/12‑V is configurable by PCB layout)
• Available in 5-step EasyWhite® bins at 2200 K & 3000 K to
5000 K CCT, 3-step EasyWhite bins at 2700 K to 5000 K and
2-step EasyWhite bins at 2700 K to 4000 K CCT
• Available in ANSI white bins at 3000 K to 7000 K CCT
• Available in standard, 70-, 80-, 90-, and 95‑minimum CRI options
• Broadcast color option at 5700 K provides maximum
performance for TV events that require extremely high TLCI
• Binned at 85 °C
• Maximum drive current: 6000 mA (3 V), 3000 mA (6 V),
1500 mA (12 V)
• Low thermal resistance: 0.4 °C/W
• Wide viewing angle: 120°
• Unlimited floor life at ≤ 30 ºC/85% RH
• Reflow solderable - JEDEC J‑STD‑020C
• RoHS and REACH compliant
• UL® recognized component (E349212)
 
This document outlines the core characteristics of XHP50.3 LEDs, which are tested and binned in 3-V and 12-V configurations (pad layout options are available in the Mechanical Dimensions section on page 43). Thermally, the junction-to-solder-point thermal resistance is typically 0.4 °C/W, measured per the JEDEC JESD51-14 standard. Optically, the viewing angle (FWHM) is typically 120 degrees. The temperature coefficient of voltage varies by configuration: -1.4 mV/°C (3 V), -2.8 mV/°C (6 V, calculated reference data), and -5.6 mV/°C (12 V). For reliability, the ESD withstand voltage is Class 3B (HBM per Mil-Std-883D). Electrically, the maximum DC forward current is 6000 mA (3 V), 3000 mA (6 V, calculated reference data), and 1500 mA (12 V); the reverse voltage (6 V) is 1 V. Forward voltage at 85 °C is typically 2.8 V (max 3.1 V) for 3 V @ 2800 mA, 5.6 V (max 6.2 V) for 6 V @ 1400 mA (calculated reference data), and 11.2 V (max 12.4 V) for 12 V @ 700 mA. The maximum LED junction temperature is 150 °C, with 6-V configuration data noted as calculated and for reference only. 
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
Product Description
Model No
XHP50.3
Chip Brand
CREE
Maximum drive current
6000 mA (3 V), 3000 mA (6 V), 1500 mA (12 V)
size
5050
power
18W
Applications
stadium, outdoor area and architectural spotlight.
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
Company Profile
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
Packing & Delivery
5050 High Power LED Chip Diode High Intensity High Density HD HI 3v 6v 12v 18w CreeXHP50.3 White
FAQ

FAQ & Service Support
1. How do you guarantee quality and after-sales service?
Quality Guarantee: We offer an industry-leading 5-year quality warranty. Every batch undergoes a rigorous 1:1 performance inspection before shipment.
100% Authenticity Commitment: We guarantee genuine products with full traceability for world-leading brands:
LED Brands: CREE, AMS OSRAM, LUMILEDS, LUMINUS, Bridgelux, Samsung, TSLC, LEDVANCE.
IC & Semiconductors: TI, ST, ADI, ONSEMI, NXPs, Nexperia, Renesas, Infineon.
Equivalent Solutions: To address original factory stockouts or cost-optimization requirements, we offer premium alternative solutions. All components undergo strict reliability testing to ensure core parameters are highly compatible with original specifications.
Specialized QC:
LEDs: Focused on photoelectric consistency (Flux, CCT, Voltage).
IC Chips: Rigorous testing of functional stability and performance metrics.

PCBA: 100% circuit reliability testing (ICT/FCT) to ensure system integrity.
Technical Support: We provide expert guidance for application challenges. Should any non-human quality anomaly occur, we assist with professional technical analysis and provide efficient replacement or tailored solutions.

 

2. How do I place an order?
Sample Orders: Contact our sales representatives for Datasheets and rapid sample testing. We facilitate an efficient sampling process to accelerate your R&D verification.
Bulk Orders: For volume procurement, we provide highly competitive tiered wholesale pricing and optimized global logistics to minimize your costs and lead times.

 

3. What payment methods are available?
We support secure and flexible global payment channels:

Digital Payment: Visa, Mastercard, and e-Checking (US customers enjoy zero transfer fees).
Corporate Transfer: T/T (Wire Transfer) is highly recommended for large transactions due to lower fees and high processing efficiency.
Others: Western Union and other traditional payment methods are also accepted.

 

4. Do you support global Drop Shipping?
Yes. We have a robust logistics system supporting global one-piece drop shipping. Given the sensitivity of LEDs and chips, we utilize industrial-grade anti-static (ESD) and vacuum moisture-proof packaging to ensure component safety and reliability during long-distance transit.

 

5. Do you offer OEM/ODM customization services?
Absolutely. As a leading integrated provider of "Chip + LED + PCBA" solutions, we offer full-cycle customization:

Optical Optimization: Specific spectrum/wavelength binning, CRI tuning, and brightness optimization.
Hardware Development: PCB layout design, component sourcing, and high-precision SMT assembly.
Branding: Logo laser engraving, private labeling, and custom packaging compliant with international standards.