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CREE LED Chip
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XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light

XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light

Brand Name: Cree
Model Number: XQE
MOQ: 500
Price: $1.64-2.04
Payment Terms: T/T
Detail Information
Place of Origin:
CN
Color Temperature(CCT):
2700k-6500k
Luminous Efficacy(lm/w):
150
Color Rendering Index(Ra):
80
Emitting Color:
Red, Cool White, Natural White, Neuter, Warm White, Orange, Yellow
Input Voltage(V):
3V
Operating Temperature(℃):
-40 - 125
Storage Temperature(℃):
-40 - 125
Viewing Angle(°):
120
Product Name:
XQE
Application:
Electronics,traffic,stage
Supply Ability:
1000000
Highlight:

1A CREE LED Chip

,

1616 CREE SMD LED

,

3W SMD LED

Product Description

Original High Power SMD XQE 1616 Lamp Beads 3W 3V 1A White Color CREE Led Chip Light High Density

 

PRODUCT DESCRIPTION
The XLamp® XQ-E LEDs are available in two versions: high density
and high intensity. The XQ-E High Density LED enables lighting
manufacturers to significantly reduce the size and total cost of
their LED luminaires versus similar performance 3.5-mm footprint
LEDs, without sacrificing lumen output, efficacy or reliability. The
XQ-E’s combination of optical symmetry, consistent design across
all configurations and tiny 1.6 mm X 1.6 mm footprint simplifies
manufacturing and design while providing excellent color mixing.
The new XQ-E High Intensity LED uses an innovative primary optic
design optimized to deliver maximum candela, especially through
narrow-beam secondary optics.
 
FEATURES
• Cree LED’s smallest lighting class LED: 1.6 mm X 1.6 mm
• Available in high-density & high-intensity versions for design
flexibility
• Available in 70, 80, & 90 CRI white, royal blue, blue, PC blue,
cyan, PC cyan, green, PC lime, PC amber, red-orange, red &
high efficiency (HE) photo red
• Maximum drive current: 1.5 A (high density & high intensity)
• Reflow solderable - JEDEC J-STD‑020C compatible
• Unlimited floor life at ≤ 30 °C/85% RH
• RoHS and REACH compliant
• UL® recognized component (E349212)
 
The XLAMP XQ-E white LEDs are available in two distinct variants: High Density White and High Intensity White, each with tailored optical and thermal specifications. For High Density White LEDs, the thermal resistance from junction to solder point is typically 3.5 °C/W for white versions and 4 °C/W for 1800 K white variants, with measurements conducted in accordance with the JEDEC JESD51-14 standard (further details available in the Thermal Resistance Measurement application note). The viewing angle (FWHM) is 110 degrees for standard white and 105 degrees for 1800 K white, while the High Intensity White variant offers a wider viewing angle of 120 degrees for both white and 1800 K white options. Both variants share a temperature coefficient of voltage of -1.2 mV/°C and Class 3B ESD classification (HBM per Mil-Std-883D), ensuring robust electrostatic discharge protection.
 
In terms of electrical performance, the maximum DC forward current for both variants is 1500 mA, with a maximum reverse voltage rating of 1 V. At 85 °C and 350 mA, the High Density White LEDs have a typical forward voltage of 2.8 V (maximum 3.25 V), while the High Intensity White LEDs feature a slightly lower typical forward voltage of 2.75 V (also with a maximum of 3.25 V). The maximum allowable LED junction temperature for all variants is 150 °C, establishing the upper safe operating temperature limit to maintain performance and reliability.

 

XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
Product Description
Model No
XQE
Chip Brand
CREE
Lifespan
50,000 hours
Warranty
3 years
Applications
1,LED Lighting industry(Tube,Panel Light,Ceiling Light,Bulb light etc) 2,Landscape lighting (LED Strip,Wall washer lamp,Garden
light etc) 3,Plant grow light 4,Sterilization and Disinfection 5,Money detector 
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
Company Profile
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
Packing & Delivery
XQE 1616 SMD 3W CREE LED Chip Original High Power White Color 3V 1A High Density Lamp Beads Light
FAQ

FAQ & Service Support
1. How do you guarantee quality and after-sales service?
Quality Guarantee: We offer an industry-leading 5-year quality warranty. Every batch undergoes a rigorous 1:1 performance inspection before shipment.
100% Authenticity Commitment: We guarantee genuine products with full traceability for world-leading brands:
LED Brands: CREE, AMS OSRAM, LUMILEDS, LUMINUS, Bridgelux, Samsung, TSLC, LEDVANCE.
IC & Semiconductors: TI, ST, ADI, ONSEMI, NXPs, Nexperia, Renesas, Infineon.
Equivalent Solutions: To address original factory stockouts or cost-optimization requirements, we offer premium alternative solutions. All components undergo strict reliability testing to ensure core parameters are highly compatible with original specifications.
Specialized QC:
LEDs: Focused on photoelectric consistency (Flux, CCT, Voltage).
IC Chips: Rigorous testing of functional stability and performance metrics.

PCBA: 100% circuit reliability testing (ICT/FCT) to ensure system integrity.
Technical Support: We provide expert guidance for application challenges. Should any non-human quality anomaly occur, we assist with professional technical analysis and provide efficient replacement or tailored solutions.

 

2. How do I place an order?
Sample Orders: Contact our sales representatives for Datasheets and rapid sample testing. We facilitate an efficient sampling process to accelerate your R&D verification.
Bulk Orders: For volume procurement, we provide highly competitive tiered wholesale pricing and optimized global logistics to minimize your costs and lead times.

 

3. What payment methods are available?
We support secure and flexible global payment channels:

Digital Payment: Visa, Mastercard, and e-Checking (US customers enjoy zero transfer fees).
Corporate Transfer: T/T (Wire Transfer) is highly recommended for large transactions due to lower fees and high processing efficiency.
Others: Western Union and other traditional payment methods are also accepted.

 

4. Do you support global Drop Shipping?
Yes. We have a robust logistics system supporting global one-piece drop shipping. Given the sensitivity of LEDs and chips, we utilize industrial-grade anti-static (ESD) and vacuum moisture-proof packaging to ensure component safety and reliability during long-distance transit.

 

5. Do you offer OEM/ODM customization services?
Absolutely. As a leading integrated provider of "Chip + LED + PCBA" solutions, we offer full-cycle customization:

Optical Optimization: Specific spectrum/wavelength binning, CRI tuning, and brightness optimization.
Hardware Development: PCB layout design, component sourcing, and high-precision SMT assembly.
Branding: Logo laser engraving, private labeling, and custom packaging compliant with international standards.